NOT KNOWN FACTUAL STATEMENTS ABOUT MONOCRYSTALLINE SILICON

Wire-saw wafer slicing is amongst the essential output systems for industrial crystalline silicon PV cells, and enhancements in wafer slicing technologies have resulted in a discount in raw wafer thickness from 370 μm to 180 μm considering that 1997 for Sharp industrial polycrystalline-silicon cells (Determine 6). To introduce wafers thinner than